Profile

Testech inspects BGA and CSP substrate products using auto-visual inspection machine. This machine is networked with the verification machines and laser machine that enables the auto line to accurately inspects and identify parts not conforming the customer’s requirement. This auto line includes water rinsing machine using DI water.

Its world class inspection facility, highly skilled manpower and state-of-the-art visual inspection equipment ensures the highest quality and productivity. Its strategic location makes Testech's services flexible and cost-effective in meeting customer needs.

Testech's inspectors are trained to manually inspect the following package types with great accuracy: System in Package (SIP), Chip Array Ball Grid Array (CABGA), Plastic Ball Grid Array (PBGA), Multimedia Memory Card (MMC), Tape Array Ball Grid Array (TABGA), Micro Lead Frame (MLF), Super Ball Grid Array (SBGA), Flip Chip Ball Grid Array (FCBGA), FlopChip-Chip Scale Package (FC-CSP).